COLUMBUS, MD, UNITED STATES, January 27, 2026 /EINPresswire.com/ -- Prem Kireet Chowdary Nimmalapudi, an AI engineer, ...
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Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: With the rapid development of artificial intelligence technology, the field of smart tourism is undergoing an unprecedented transformation. This paper proposes an AI large model-assisted ...
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