In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, ...

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

Physical AI is one of the hardest engineering problems the technology industry has faced. Autonomous vehicles, industrial robots, delivery drones, surgical assistants, and humanoids have to sense the ...

As AI moves into embedded systems, engineers must address new challenges around resilience, recovery, telemetry, and auditability. Physical AI introduces operating constraints that cloud ...